Title:
研磨布のドレッシング方法およびドレッシング装置
Document Type and Number:
Japanese Patent JP5610615
Kind Code:
B2
Abstract:
The method of the present invention are capable of stabilizing a polishing rate, reducing number of times of performing dressing operations, improving work efficiency and extending a span of life of the polishing pad. The method for dressing a polishing pad, which has been used to polish a surface of a work by pressing the work onto the polishing pad fixed on a polishing plate (14, 15) with supplying slurry thereto, by using a grind stone, comprising the step of cleaning the polishing pad by supplying high-pressure cleaning water to the polishing pad, is characterized by the step of dressing the polishing pad by moving a dressing grind stone (26), in the radial direction of the polishing pad, along a surface profile thereof, while performing the cleaning step.
Inventors:
小山 晴道
Application Number:
JP2010140995A
Publication Date:
October 22, 2014
Filing Date:
June 21, 2010
Export Citation:
Assignee:
不二越機械工業株式会社
International Classes:
B24B53/007; B24B37/00; B24B53/017; B24B53/02; B24B53/095
Attorney, Agent or Firm:
Takao Watanuki
Kazuharu Horigome
Yoshihiro Hirai
Masahiko Denda
Takashi Okamura
Kazuharu Horigome
Yoshihiro Hirai
Masahiko Denda
Takashi Okamura