Title:
研磨剤組成物
Document Type and Number:
Japanese Patent JP7440326
Kind Code:
B2
Abstract:
To provide an abrasive composition, capable of preventing carrier noise at polishing when polishing an oxide single crystal substrate and capable of improving the flatness of a polished surface after polishing and also improving a polishing speed.SOLUTION: An abrasive composition includes silica particles, water-soluble polymer compounds and water. The water-soluble polymer compound is a copolymer including the monomer having at least a carboxylic acid group and that having a sulfonic acid group as an essential monomer. The molar ratio of a constitutional unit derived from the monomer having the sulfonic acid group to such a unit derived from the monomer having carboxylic acid group is in a range of 95:5 to 5:95, and the weight average molecular weight of the water-soluble polymer compound is in the range of 1,000 to 5,000,000. The abrasive is used for polishing a lithium tantalate single crystal material or lithium niobate single crystal material.SELECTED DRAWING: None
Inventors:
Akihiro Kawahara
Kenji Naito
Kenji Naito
Application Number:
JP2020066022A
Publication Date:
February 28, 2024
Filing Date:
April 01, 2020
Export Citation:
Assignee:
Yamaguchi Seiken Industry Co., Ltd.
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| JP2017075316A | ||||
| JP2019016417A | ||||
| JP2019006935A | ||||
| JP2017218514A | ||||
| JP2016084428A |
Foreign References:
| US20160222254 |
Attorney, Agent or Firm:
Ippei Watanabe
Sei Koike
Yoshio Nagaoka
Satoshi Asakura
Sei Koike
Yoshio Nagaoka
Satoshi Asakura
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