Title:
無砥粒ケミカルメカニカルポリッシング組成物
Document Type and Number:
Japanese Patent JP5091400
Kind Code:
B2
Abstract:
An aqueous abrasive-free composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition comprises an oxidizer, an inhibitor for the nonferrous metal, 0 to 15 weight percent water soluble modified cellulose, 0 to 15 weight percent phosphorus compound, 0.005 to 5 weight percent of an amphiphilic polymer, the amphiphilic polymer having an ionic hydrophilic portion with a carbon number of 2 to 250 and water.
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Inventors:
Tarthanker Gauche
Robert Dee Solomon
Hong Yu Wan
Robert Dee Solomon
Hong Yu Wan
Application Number:
JP2005338383A
Publication Date:
December 05, 2012
Filing Date:
November 24, 2005
Export Citation:
Assignee:
Rohm and Haas Electronic Materials CMP Housings, Inc.
International Classes:
H01L21/304; B24B37/00; C09K13/00
Domestic Patent References:
| JP2003282496A |
Attorney, Agent or Firm:
Hajime Tsukuni
Fumio Shinoda
Koshiro Tsukuda
Fumio Shinoda
Koshiro Tsukuda