To efficiently embed abrasive grains into a polishing surface plate while suppressing the dispersion of embedded abrasive grains.
In this abrasive grain embedding device for embedding the abrasive grains contained in a polishing fluid into the surface of the polishing surface plate by pressing the polishing surface plate by a pressing means through the polishing fluid while supplying the polishing fluid containing abrasive grains on the surface of the polishing surface plate and slidably moving the pressing means and the polishing surface plate, the pressing means includes one or more pressing members, a weight member which is disposed above the pressing members and presses the pressing members against the polishing surface plate, and an ultrasonic transducer for providing ultrasonic wave to the pressing members. Since the pressing member includes a pressing surface on which a plurality of disk-like pressing chips are disposed, the lengths of the pressing surfaces are equal to each other in the direction in which the pressing means and the polishing surface plate are slidably moved relative to each other to suppress the dispersion of a fluid stress. Consequently, the dispersion of the abrasive grains embedded into the polishing surface plate can be suppressed.
TASHINO FUMITERU
OKA TOSHIAKI
IWATA HISAYA
| JP2009291911A | 2009-12-17 | |||
| JPWO03059576A1 | ||||
| JP2009105440A | 2009-05-14 | |||
| JPH0392264A | 1991-04-17 | |||
| JPH11213367A | 1999-08-06 |
Isao Sasaki
Ken Kubo