Title:
ラッピング装置向け砥粒埋め込み具
Document Type and Number:
Japanese Patent JP4121086
Kind Code:
B2
Abstract:
A pad of an embedding tool is received on a faceplate. The pad is supported on a support member. When the embedding tool is urged against the surface of the faceplate, the pad is allowed to change the attitude relative to the support member in response to undulation generated on the surface of the faceplate. The movement of the flat surface follows the undulation of the faceplate. When a relative movement is induced between the embedding tool and the surface of the faceplate, the surface of the faceplate thus reliably receives the uniform or constant contact of the flat surface. When grains are supplied between the flat surface of the pad and the surface of the faceplate, the grains are uniformly pushed into the surface of the faceplate. In this manner, the grains are uniformly and constantly embedded into the surface of the faceplate.
Inventors:
Mitsuo Takeuchi
Yoshiaki Yanagita
Yuichi Sugiyama
Tsutomu Soda
Yoshiaki Yanagita
Yuichi Sugiyama
Tsutomu Soda
Application Number:
JP2003559723A
Publication Date:
July 16, 2008
Filing Date:
December 27, 2001
Export Citation:
Assignee:
富士通株式会社
International Classes:
B24D18/00; B24B7/22; B24B37/12; B24B53/12
Domestic Patent References:
| JP10134316A | ||||
| JP10249714A | ||||
| JP3233412A | ||||
| JP11123651A | ||||
| JP60242964A | ||||
| JP2000024914A | ||||
| JP8025213A | ||||
| JP2001232558A |
Attorney, Agent or Firm:
山▲崎▼ 薫