Title:
高分子リン酸化アミドを含むアブレーティブ材料
Document Type and Number:
Japanese Patent JP7066383
Kind Code:
B2
Abstract:
An ablative material comprises a phenolic resin, a polymeric phosphorylated amide, and a number of fillers. The polymeric phosphorylated amide is in the ratio of between 1 and 10 parts of the polymeric phosphorylated amide per 100 parts of phenolic resin or resin solids, by weight.
Inventors:
Michelle Chaffee
Arthur Rojo
Arthur Rojo
Application Number:
JP2017226627A
Publication Date:
May 13, 2022
Filing Date:
November 27, 2017
Export Citation:
Assignee:
The Boeing Company
International Classes:
C08L61/06; B29C70/00; C08K7/02; C08K7/22; C08L85/02; C09K21/14
Foreign References:
| US20090311468 | ||||
| US4403075 |
Attorney, Agent or Firm:
Murayama Yasuhiko
Tatsuhiko Abe
Shinpei Kuroda
Choe Yun
Tatsuhiko Abe
Shinpei Kuroda
Choe Yun