Title:
ABRASIVE PAD WITH POLISHING SURFACE LAYER HAVING OPENING OR OPEN PART ABOVE TRANSPARENT GROUND LAYER
Document Type and Number:
Japanese Patent JP2016074086
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an abrasive pad with a polishing surface having an opening or an open part above a transparent ground layer.SOLUTION: An abrasive pad with a polishing surface having an opening or an open part above a transparent ground layer is provided. According to an example, an abrasive pad for polishing a substrate includes a ground layer having a wide area top face and a transparent region. A polishing surface layer is attached onto the wide area top face of the ground layer. The polishing surface layer has a polishing surface and a rear face. The opening is located in the abrasive pad through the polishing surface of the polishing surface layer from the rear face, and is aligned with the transparent region of the ground layer. The ground layer provides an impermeable seal for the opening on the rear face of the polishing surface layer. Also, a method for processing such an abrasive pad is provided.SELECTED DRAWING: Figure 3A
Inventors:
PAUL ANDRE LEFEVRE
ALLISON WILLIAM C
JAMES P LACASSE
SCOTT DIANE
ALEXANDER WILLIAM SIMPSON
HUANG PING
LESLIE M CHARNS
ALLISON WILLIAM C
JAMES P LACASSE
SCOTT DIANE
ALEXANDER WILLIAM SIMPSON
HUANG PING
LESLIE M CHARNS
Application Number:
JP2016014125A
Publication Date:
May 12, 2016
Filing Date:
January 28, 2016
Export Citation:
Assignee:
NEXPLANAR CORP
International Classes:
B24B37/22; B24B37/24; H01L21/304
Domestic Patent References:
| JP2008226911A | 2008-09-25 | |||
| JP2009060044A | 2009-03-19 | |||
| JP2008539093A | 2008-11-13 | |||
| JP2009033193A | 2009-02-12 |
Foreign References:
| US20100330879A1 | 2010-12-30 | |||
| WO2012005778A1 | 2012-01-12 |
Attorney, Agent or Firm:
Hidesaku Yamamoto
Natsuki Morishita
Takatoshi Iida
Daisuke Ishikawa
Kensaku Yamamoto
Natsuki Morishita
Takatoshi Iida
Daisuke Ishikawa
Kensaku Yamamoto