Title:
研磨パッド
Document Type and Number:
Japanese Patent JP5031236
Kind Code:
B2
Abstract:
To provide a polishing pad which is insusceptible to clogging of groove with abrasive particles and grinding dusts during polishing, and leads to little decrease in polishing rate even after long-term continuous use. A polishing pad of the present invention has a polishing layer formed of polyurethane resin foam having fine-cells, and asperity structure formed in a polishing surface of the polishing layer, and is featured in that the polyurethane resin foam is a reaction cured product between isocyanate-terminated prepolymer containing high-molecular-weight polyol component and isocyanate component, and a chain extender, and contains a silicon-based surfactant having combustion residue of not less than 8 wt %.
Inventors:
Fukuda Takeshi
Junji Hirose
Doura Masato
Junji Hirose
Doura Masato
Application Number:
JP2006006210A
Publication Date:
September 19, 2012
Filing Date:
January 13, 2006
Export Citation:
Assignee:
TOYO TIRE & RUBBER CO.,LTD.
International Classes:
B24B37/24; B24B37/20; C08G18/00; H01L21/304
Domestic Patent References:
| JP2003218074A | ||||
| JP2005120275A |
Other References:
監修:松永勝治,最新ポリウレタン材料と応用技術-ポリウレタン創製への道-,日本,株式会社シーエムシー出版,2005年 9月30日,第1刷,107
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi