Title:
研磨材の回収方法
Document Type and Number:
Japanese Patent JP4534241
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an abrasive recovering device to efficiently recover abrasive particles for re-utilization from polishing process drain containing abrasive discharged from a CMP process used in a semiconductor manufacturing factory. SOLUTION: In a device for recovering abrasive from CMP process waste liquid, the abrasive recovering device comprises a recovery means to recover waste slurry flying at the polishing part of a CMP machine; a film separating means to which waste slurry from the recovering means is introduced: and a washing means to wash condensate, obtained by the film separating means, by water.
Inventors:
Akira Matsumoto
Kazuki Hayashi
Kazuki Hayashi
Application Number:
JP2000194672A
Publication Date:
September 01, 2010
Filing Date:
June 28, 2000
Export Citation:
Assignee:
Kurita Water Industries Ltd.
International Classes:
B24B57/02; B01D61/14; B24B37/00; C02F1/00; C02F1/44; H01L21/304
Domestic Patent References:
| JP11121408A | ||||
| JP2000071172A | ||||
| JP11172237A | ||||
| JP8115892A | ||||
| JP11012562A |
Attorney, Agent or Firm:
Mitsuru Uchiyama