研磨剤、研磨剤セット及び基板の研磨方法

Title:

研磨剤、研磨剤セット及び基板の研磨方法

Document Type and Number:

Japanese Patent JPWO2010143579

Kind Code:

A

More Like This:

JP3496585	POLISHING METHOD OF SUBSTRATE
JP2022112498	FORMULATIONS FOR HIGH POROSITY CHEMICAL MECHANICAL POLISHING PADS WITH HIGH HARDNESS AND CMP PADS MADE THEREWITH
JP3638456	SUBSTRATE ATTITUDE CHANGING DEVICE

Inventors:

Daisuke Ryuzaki
Star Yosuke
Field part 茂
Kazuhiro Enomoto

Application Number:

JP2010059436W

Publication Date:

November 22, 2012

Filing Date:

June 03, 2010

Export Citation:

Assignee:

Hitachi Chemical Co., Ltd.

International Classes:

H01L21/304; B24B37/00; B24B37/20

Attorney, Agent or Firm:

Hidekazu Miyoshi

Previous Patent: アルキルスルホン化合物の製造方法

Next Patent: VEHICLE BEHAVIOR CONTROLLER