Title:
ABRASIVES FOR BARRIER FILM
Document Type and Number:
Japanese Patent JP2001338900
Kind Code:
A
Abstract:
To provide abrasives for a barrier film capable of flatly finishing a surface of a semiconductor substrate by selectively polishing the barrier film with respect to an insulating film.
The abrasive for the barrier film comprises fumed silica having a specific surface area of 80 m2/g or more, an inorganic acid salt, an oxidizer and a solvent in such a manner that a concentration of the inorganic acid salt is in a range of 10 to 5,000 ppm and its pH is regulated to a range of 3 to 8.
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Inventors:
Hayashi, Kazuhiko
Kato, Hiroshi
Mochizuki, Naoto
Kato, Hiroshi
Mochizuki, Naoto
Application Number:
JP2000000348036
Publication Date:
December 07, 2001
Filing Date:
November 15, 2000
Export Citation:
Assignee:
TOKUYAMA CORP
International Classes:
B24B37/00; C09K3/14; H01L21/304; (IPC1-7): H01L21/304; B24B37/00; C09K3/14