Title:
吸収式ヒートポンプ装置
Document Type and Number:
Japanese Patent JP6870171
Kind Code:
B2
Abstract:
To provide an absorption type heat pump device which can sufficiently secure a clearance between an outer surface of a heat exchanger and a supply part while supplying a solution to the outer surface of the heat exchanger by using the supply part.SOLUTION: This absorption type heat pump device 100 comprises: a vessel 41 having a liquid sump part 41a; a heat exchanger plate 43 in which cooling water flows; a rotating supply body 60 for scooping up an absorption liquid stored in the liquid sump part 41a, and supplying it to an outer surface 43a of the heat exchanger plate 43; and a shaft movement mechanism part 50 which is constituted so as to be capable of linearly moving a shaft part 51 attached to the rotating supply body 60. The absorption type heat pump device 100 makes the rotating supply part 60 scoop up the absorption liquid stored in the liquid sump part 41a by linearly moving the shaft part 51 to a direction orthogonal to the outer surface 43a of the heat exchanger plate 43, and supplies the liquid to the outer surface 43a of the heat exchanger plate 43.SELECTED DRAWING: Figure 7
Inventors:
Yusuke Ebata
Application Number:
JP2017100150A
Publication Date:
May 12, 2021
Filing Date:
May 19, 2017
Export Citation:
Assignee:
Aisin Co., Ltd.
International Classes:
F25B15/00; F25B37/00
Domestic Patent References:
| JP2015114093A | ||||
| JP2169783A | ||||
| JP2006182547A |
Foreign References:
| US20080314069 |
Attorney, Agent or Firm:
Hirokazu Miyazono