PURPOSE: To reduce the output change caused by temperature when a three-layer structure body is mounted on a mounting substrate by bonding a spacer between both parts, and forming air bubbles in the bonding agent between the structure body and the spacer.
CONSTITUTION: A silicon substrate 1 is patterned by photolithography and etched, and a movable electrode 6 and a cantilever 7 are formed. Fixed electrodes 4 and 5 are formed on upper and lower glass substrates 2 and 3. Anodes are bonded at the upper and lower parts of the substrate 1, and the three layers are formed. The electrodes 4 and 5 face the electrode 6. The capacitances between the electrodes 4 and 5 and the electrode 6 are changed with respect to applied acceleration. An acceleration detecting part 12 which is formed in this way is bonded on a mounting substrate 9 with bonding agents 10 and 11 through a spacer 8. At this time, a screen mask is used, and the bonding agent 10 is printed. The thickness is secured, and dispersion is decreased. At the same time, air bubbles 13 are formed, and stress caused by heat is decreased. Thus, the highly accurate detector, whose output change caused by temperature change is small, can be obtained.
| JP6531279 | Acceleration sensor |
| WO/1988/001242 | CIRCUIT AND PROCESS FOR CHECKING ELECTRONIC SENSORS |
| WO/1991/017072 | MONITORING DEVICE FOR A DIGITAL FREQUENCY MEASURING DEVICE |
EBINE HIROMICHI
KUBOTA MASANORI
ASANO YASUHIRO
HITACHI CAR ENGINEERING KK