To attain a miniaturization of a dimension of an acceleration sensor concerning a direction of a semiconductor substrate major face by inhibiting a propagation of a crack by an external force.

The acceleration sensor 2 comprises the semiconductor substrate 6, a frame 8 surrounding the acceleration sensor element 3 and the acceleration sensor element 3 which are arranged on the semiconductor substrate 6, the intermediate layers 34, 36 arranged on the frame 8, and a cap 5 which performs a sealing of the acceleration sensor element 3 connecting with the intermediate layers 34, 36. In each of the frame 8 and the intermediate layers 34, 36, a frame-like groove is formed nearly the same position relating to the major face of the semiconductor substrate 6. Therefore, the frame-like groove 38 is prepared as a whole.