To provide an acceleration sensor with its acceleration sensor chip downsized and with metallic wiring of the sensor chip prevented from being damaged by a spacer member in the process of bonding the sensor chip to a stopper.
This acceleration sensor includes the acceleration sensor chip 1, a tabular stopper 2 disposed opposite to one surface of the sensor chip 1 to regulate excessive displacement of a weight part 12, the spacer member 8 provided between a peripheral part of the stopper 2 and a frame part 11 of the sensor chip 1, and a bond part 6 comprising a bonding agent for covering the spacer member 8 and bonding the peripheral part of the stopper 2 to the frame part 11 of the sensor chip 1. A protective film 17 made of an inorganic material is formed on the one surface side of the frame part 11 of the sensor chip 1 for protecting a portion of the metallic wiring 16 overlapping with the spacer member 8, out of the metallic wiring 16 electrically connected to a piezoresistance R which is a gauge resistance.
| JPS63502850 | [Title of the Invention] Acceleration detector |
| JP2001066319 | SEMICONDUCTOR ACCELEROMETER |
| JP2812007 | [Title of Invention] Accelerometer |
YOSHIDA HITOSHI
KONISHI YASUJI
| JP2001305152A | 2001-10-31 | |||
| JPH04274005A | 1992-09-30 | |||
| JPH11174079A | 1999-07-02 | |||
| JPS63198378A | 1988-08-17 | |||
| JPH0263173A | 1990-03-02 |
Atsuo Mori
Next Patent: ACCELERATION SENSOR