To provide an acceleration sensor capable of reducing an influence of a stray capacitance, while enhancing sealability.
Through-holes 80a, 80b, 90a, 90b of through-hole wiring parts 8a, 8b, 9a, 9b are blocked by electrode parts 81a, 81b, 91a, 91b made of silicon substrates. Hereby, sealability of a sensor chip 1 can be enhanced. Each dimension (longitudinal/lateral dimension) of the electrode parts 81a, 81b, 91a, 91b is set to be smaller than an opening diameter 1 on each one surface side (each under surface side) of the through-holes 80a, 80b, 90a, 90b, and set to be larger than an opening diameter 2 on each other surface side (each upper surface side) thereof, to thereby reduce an influence of a stray capacitance generated between the electrode parts 81a, 81b, 91a, 91b and the sensor chip 1.
IBARA NOBUYUKI
YOSHIDA HITOSHI
OKADA MASAFUMI
MORI TAKASHI
