Title:
集積マイクロ波送受信機タイル構造
Document Type and Number:
Japanese Patent JP2007508570
Kind Code:
A
Abstract:
Integrated microwave modular transceiver tile structure in the form of a cube-like configuration, and including (a) a first, generally planar, circuit-board layer structure possessing an array of plural, integrally formed microwave transceivers arranged in a defined row-and-column pattern, with each transceiver having an associated transceiver axis extending generally normal to the plane of said the first layer structure, and (b) a second, generally planar, circuit-board layer structure including transceiver-function operational circuitry operatively connected to the transceivers, and functional to promote operation of the transceivers simultaneously in transmission and reception modes of operation.
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Inventors:
Yukuru, Tex
Application Number:
JP2006535587A
Publication Date:
April 05, 2007
Filing Date:
October 12, 2004
Export Citation:
Assignee:
Emit Technologies LLC
International Classes:
G01S7/03; G01S13/04; H01Q15/02; H01Q15/24; H01Q21/00; H01Q21/08; H01Q
Attorney, Agent or Firm:
Kazuo Shamoto
Shinjiro Ono
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Motoharu Nakanishi
Shinjiro Ono
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Motoharu Nakanishi