Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ACF STICKING DEVICE AND ACF STICKING METHOD
Document Type and Number:
Japanese Patent JP2013251357
Kind Code:
A
Abstract:

To provide an ACF sticking device capable of stably peeling a base tape with a simple arrangement and an ACF sticking method.

A tape member Tp having an ACF tape 4 stuck on one side of a base tape BT is conveyed with a base material 2 the upper of which is held in a horizontal posture. After positioning an ACF piece 4 s formed on the base tape BT, which is the ACF tape 4 positioned at the top of the tape member Tp in a conveyance direction, at the upstream side of a piece sticking part 3 on the base material 2, the ACF piece 4 s is pressed to the base material 2 with a pressure tool 30 to stick the ACF piece 4 s to the base material 2. After raising the base material 2, at a position down stream side than the ACF piece 4 s stuck on the base material 2 in the conveyance direction of the tape member Tp, a pair of peeling pins 26 disposed in contact with upper face side and the bottom side of the base tape BT is moved horizontally toward the upstream of the tape member Tp in the conveyance direction; thereby the base tape BT is peeled off from the ACF piece 4 s stuck on the base material 2.


Inventors:
YAMADA SHINGO
Application Number:
JP2012124099A
Publication Date:
December 12, 2013
Filing Date:
May 31, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
PANASONIC CORP
International Classes:
H05K3/32; B65H37/04; B65H41/00; H01L21/60
Domestic Patent References:
JP2009016523A2009-01-22
JP2011014790A2011-01-20
JP2003078238A2003-03-14
JP2004279698A2004-10-07
JP2010152205A2010-07-08
JP2000340616A2000-12-08
Foreign References:
WO2012066726A12012-05-24
WO2010084728A12010-07-29
Attorney, Agent or Firm:
Hiroki Naito
Daisuke Nagano
Kentaro Fujii



 
Previous Patent: ELECTROMAGNETIC WAVE SHIELDING FILM

Next Patent: SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE