酸基含有（メタ）アクリレート樹脂及びソルダーレジスト用樹脂材料

Title:

酸基含有（メタ）アクリレート樹脂及びソルダーレジスト用樹脂材料

Document Type and Number:

Japanese Patent JP6828410

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide an acid group-containing (meth) acrylate resin that has high developability and forms a cured product with excellent heat resistance and dielectric properties, a curable resin composition containing the same, an insulation material composed of the curable resin composition, a resin material for solder resist and a resist member.SOLUTION: An acid group-containing (meth) acrylate resin contains: an epoxy resin having an alicyclic structure in the molecule (A); an unsaturated monocarboxylic acid (B); an unsaturated monocarboxylic acid anhydride (C); and a dicarboxylic anhydride (D) as essential reaction raw materials.SELECTED DRAWING: None

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Inventors:

Yamada Shunsuke
Hiroshi Kameyama

Application Number:

JP2016242250A

Publication Date:

February 10, 2021

Filing Date:

December 14, 2016

Export Citation:

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