Title:
ACIDIC COPPER PLATING BATH AND PLATING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP3263750
Kind Code:
B2
Abstract:
PURPOSE: To provide a copper plating bath excellent in appearance and physical properties in a wide range of current density at a high temp. by adding a specific quantity of a nitrogen containing organic compound, a sulfur containing organic compound, a polyether compound and the like into an acidic plating solution.
CONSTITUTION: Improving agents (1)-(5) of glossiness, smoothness, extensibility, uniform electrodepositing property, hardness or the like are incorporated in the acidic copper plating bath having a basic composition of copper sulfate, sulfuric acid and chlorine ion. (1) 0.05-0.2g/l compound expressed by a formula I (each of R1-R7 is H, OH, SO3, NH2 and (n) is 2-500), (2) 0.005-0.1g/l compound expressed by the general formula, M1SO3-R8-R9-(S)m-R10 (M1 is H, Na or the like, each of R8 and R9 is alkylene cross-linking group, R10 is H, metallic atom or the like). (3) 0.01-0.05g/l compound expressed by the formula II (each of R13-R16 is SO3 compound, (p) is 1-5), (4) 0.04-0.08g/l polyether compound having 200-105 average molecular weight. (5) 0.002-0.01g/l compound expressed by the formula III (each of R17-R21 alkylene cross-linking group or alkyl group, (q) is 2-500).
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Inventors:
Yukio Nishihama
Masahiko Ikeda
Masahiko Ikeda
Application Number:
JP30806393A
Publication Date:
March 11, 2002
Filing Date:
December 08, 1993
Export Citation:
Assignee:
Okuno Pharmaceutical Co., Ltd.
International Classes:
C25D3/38; (IPC1-7): C25D3/38
Domestic Patent References:
| JP2185992A | ||||
| JP762587A | ||||
| JP2001247994A | ||||
| JP5230687A | ||||
| JP246675B2 |
Attorney, Agent or Firm:
Eiji Saegusa (4 others)