To provide a compact and light package for an element in which an open area is provided on a die surface, any large inside accumulation is not required, and execution can be easily attained while the coherence in the design, manufacture, and use of a present acoustic element can be maintained.
A first wafer corresponding to the conversion and propagation of an acoustic wave is prepared. Next, the wafer is processed, a converter pattern is applied on it, and a sealing ring 25 is arranged on the wafer. The sealing ring 25 completely seals an active area, and the part of each bond pad 20 is projected to the outside of the sealing ring 25. Moreover, a second wafer 40 is arranged on the sealing ring 25 and the first wafer, and the second wafer 40 is closed to the first wafer. The second wafer 40 is cut by using a saw for applying a first section width, so that the part of the second wafer 40 positioned on the bonding pad 20 of the converter pattern can be removed. Then, the first wafer is cut by using a saw for applying a second section with a width narrower than the first section width, so that a packaged SAW die 102 can be obtained.
STUMBO DAVID PATRICK
YOUNG STEVEN RICHARD
ANDERSON MICHAEL
