PURPOSE: To obtain the subject composition useful for bonding between a heat- resistant resin film of flexible printed circuit board and a metal foil, having high bond strength at high temperature, flexibility, etc., by blending a specific acrylic resin with a specific polyphenol compound.

CONSTITUTION: (A) 100 pts. wt. acrylic resin obtained by copolymerizing (i) 10-50wt.% (meth)acrylonitrile or its mixture with (ii) 45-85wt.% ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate or its mixture and (iii) 2-10wt.% (meth) acrylic acid, itaconic acid or its mixture is blended with (B) 1-25 pts. wt. polyphenol compound of the formula (R1 to R3 are H, 1-6C alkyl, etc.; R4 is bifunctional organic group; (n) is average number of repeating units and is 5-50) to give the objective composition. The composition B is preferably obtained by condensing a carbonyl compound with a phenol. Formaldehyde is preferable as the carbonyl compound and o-cresol preferable as the phenol.