Title:
感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法
Document Type and Number:
Japanese Patent JP6992166
Kind Code:
B2
Abstract:
Provided is an active-ray-sensitive or radiation-sensitive resin composition which has high sensitivity and can be formed into a pattern having excellent collapse resistance. Also provided are: a resist film using the active-ray-sensitive or radiation-sensitive resin composition; a method for forming a pattern; and a method for manufacturing an electronic device. The active-ray-sensitive or radiation-sensitive resin composition contains a compound which can generate an acid upon the irradiation with an active ray or an radioactive ray and a resin of which the polarity can increase by the action of an acid, wherein the resin contains a repeating unit represented by general formula (B-1) and also contains at least one halogen atom selected from the group consisting of a fluorine atom and an iodine atom.
Inventors:
Takashi Kawashima
Akihiro Kaneko
Kenyoshi Goto
Daisuke Asakawa
Akihiro Kaneko
Kenyoshi Goto
Daisuke Asakawa
Application Number:
JP2020510420A
Publication Date:
January 13, 2022
Filing Date:
February 20, 2019
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G03F7/039; C08F24/00; C08F26/00; C08F28/00; G03F7/038; G03F7/20; G03F7/32
Domestic Patent References:
| JP2017058421A | ||||
| JP2007093909A | ||||
| JP2011195818A | ||||
| JP2010077440A |
Attorney, Agent or Firm:
Hideaki Ito
Fumio Mihashi
Fumio Mihashi
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