Title:
感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法
Document Type and Number:
Japanese Patent JP6659481
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide: an active ray- or radiation-sensitive resin composition with an excellent depth of focus (DOF) and a small pattern line width roughness (LWR) when a resist pattern is formed; and a resist film, a pattern formation method and an electronic device production method that use the active ray- or radiation-sensitive resin composition.SOLUTION: The active ray- or radiation-sensitive resin composition comprises: a resin; a photoacid generator that generates an acid upon exposure to an active ray or radiation; and a compound represented by the general formula (1) in the figure.SELECTED DRAWING: None
Inventors:
Kenyo Goto
Masashi Kojima
Asakawa Daisuke
Keita Kato
Wang Ye-yeon
Masashi Kojima
Asakawa Daisuke
Keita Kato
Wang Ye-yeon
Application Number:
JP2016130817A
Publication Date:
March 04, 2020
Filing Date:
June 30, 2016
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G03F7/004; C07C251/44; C07C251/48; C07C251/66; C07C251/68; C07C251/86; C07C309/63; C07C381/12; C09K3/00; G03F7/038; G03F7/039; G03F7/20; G03F7/32
Domestic Patent References:
| JP2012181510A | ||||
| JP2002311586A | ||||
| JP2015031842A | ||||
| JP2015172768A | ||||
| JP2016042171A |
Foreign References:
| US20040013974 |
Attorney, Agent or Firm:
Haruko Sanwa
Hideaki Ito
Fumio Mitsuhashi
Hideaki Ito
Fumio Mitsuhashi