To provide a positive resist composition satisfying requirements for high sensitivity, high resolution, a good pattern profile, good line edge roughness and reduction in outgassing, in an ultrafine region, particularly, in electron beam, X-ray or EUV lithography, and to provide a method for forming a pattern by using the composition.
The actinic ray-sensitive or radiation-sensitive resin composition contains: a resin (P) having a repeating unit (A) that is decomposed by irradiation with actinic rays or radiation to generate an acid and a repeating unit (B) that is decomposed by an action of an acid to increase the solubility of the resin with an alkali aqueous solution; and a compound (U) that is unevenly present on a film surface when a film is formed, giving a protective film.
TSUCHIMURA TOMOTAKA
DOBASHI TORU
YAMASHITA KATSUHIRO
NISHIKAWA NAOYUKI
TSUBAKI HIDEAKI
| JP2010095643A | 2010-04-30 | |||
| JP2010095643A | 2010-04-30 | |||
| JP2010266842A | 2010-11-25 |
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Tetsuya Kazama
Katsumura Hiro
Shoji Kawai
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen