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Title:
ACTINIC RAY SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING PATTERN USING THE SAME
Document Type and Number:
Japanese Patent JP2012022100
Kind Code:
A
Abstract:

To provide an actinic ray sensitive or radiation sensitive resin composition that can satisfy both excellent developing property and excellent followability of immersion liquid and to provide a method for forming pattern using the composition.

An actinic ray sensitive or radiation sensitive resin composition according to the present invention is a resin (B) having at least one of fluorine atom and silicon atom and includes a resin (B) including a repeating unit expressed by the following formula (I); a resin (A) whose solubility in an alkali developing solution is increased by an action of an acid; and a compound which generates an acid upon irradiation with actinic ray or radiation.


Inventors:
IIZUKA YUSUKE
SHIBUYA AKINORI
TAKAHASHI HIDETOMO
FUKUHARA TOSHIAKI
KOSHIJIMA KOSUKE
Application Number:
JP2010159093A
Publication Date:
February 02, 2012
Filing Date:
July 13, 2010
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
G03F7/039; C08F12/04; C08F22/12; C08F22/36; G03F7/004; G03F7/38; H01L21/027
Domestic Patent References:
JP2010085971A2010-04-15
JP2009145714A2009-07-02
JP2006234938A2006-09-07
JP2007326903A2007-12-20
JP2008257166A2008-10-23
JP2010033031A2010-02-12
Foreign References:
WO2009057484A12009-05-07
Attorney, Agent or Firm:
Kurata Masatoshi
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Katsumura Hiro
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen