To provide a resin composition which is excellent in substrate adhesion and exhibits very little adhesion reduction due to heat or humidity since a conventional urethane (meth)acrylate composition had a problem that a cured product thereof is easily separated from a substrate when it is exposed to a high-temperature and high-humidity condition.
The active energy-ray curable resin composition comprises a compound (A) having one or more reactive functional groups selected from the group consisting of an epoxy group, an isocyanate group, a vinyl ether group, and a propenyl ether group, a urethane (meth)acrylate (B) except (A), a (meth)acryloyl group-containing monomer (C) except (A) which does not have a urethane bond, has a molecular weight of 100 or more, and a number average molecular weight of 1,000 or less, and a photopolymerization initiator (D).
HORI KENZO
YAMASHITA TSUTOMU
