To provide an active energy ray-curable resin composition that has excellent adhesion to a metal substrate such as aluminum, SUS or the like and produces a cured film hardly causing the peeling and appearance change of the film under severe conditions such as during boiling of the coated metal substrate.

The active energy ray-curable resin composition includes (A) a urethane (meth)acrylate compound produced by reacting (a1) a hydroxyl group-containing (meth)acrylate compound, (a2) a polyisocyanate compound and (a3) a polyol compound, (B) a urethane (meth)acrylate compound produced by reacting (b1) a hydroxyl group-containing (meth)acrylate compound and (b2) a polyisocyanate compound, (C) an acrylic resin, (D) a polysaccharide derivative and (E) a phosphate group-containing ethylenically unsaturated compound.