Title:
活性エステル組成物及び半導体封止材料
Document Type and Number:
Japanese Patent JP7276665
Kind Code:
B2
Abstract:
There are provided an active ester composition that has high curability and that provides a cured product exhibiting excellent performance, such as in dielectric characteristics and heat resistance; a cured product of the composition; and a semiconductor sealing material and a printed wiring board that are formed from the composition. Specifically, an active ester composition containing an active ester compound and a benzoxazine compound as essential components is provided. Because the active ester composition containing the active ester compound and the benzoxazine compound as essential components is characterized by having high curability with a curing agent and providing a cured product exhibiting excellent performance, such as in dielectric characteristics and heat resistance, the active ester composition is suitable for use as a resin material for semiconductor sealing materials and printed wiring boards.
Inventors:
Yasushi Sato
Akihito Kawasaki
Akihito Kawasaki
Application Number:
JP2019526744A
Publication Date:
May 18, 2023
Filing Date:
June 05, 2018
Export Citation:
Assignee:
DIC Corporation
International Classes:
C08L63/00; C07C69/80; C07D265/16; C08G59/40; C08K5/50
Domestic Patent References:
| JP2014148562A | ||||
| JP2016536403A | ||||
| JP2003082063A |
Foreign References:
| CN103965624A | ||||
| US20160244471 | ||||
| WO2009038166A1 | ||||
| CN105348743A | ||||
| CN106433124A | ||||
| CN106700548A | ||||
| WO2012132936A1 | ||||
| WO2016104317A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Junias International Patent Office