Title:
活性エステル樹脂、熱硬化性樹脂組成物、その硬化物、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム
Document Type and Number:
Japanese Patent JP5500408
Kind Code:
B2
Abstract:
A cured product exhibits good heat resistance and flame retardancy as well as low dielectric constant and low loss tangent. A phosphorus-containing compound (i) obtained by a reaction between an aromatic aldehyde (a1) having an alkoxy group as a substituent on a nucleus and an organic phosphorus compound (a2) having a P—H group or a P—OH group in a molecular structure is reacted with a phenolic substance (a3) to obtain a phosphorus-containing phenolic substance (A1). Then the phosphorus-containing phenolic substance (A1) is reacted with an aromatic dicarboxylic acid or an anhydride or dihalide of an aromatic dicarboxylic acid or a C2-6 saturated dicarboxylic acid or an anhydride or dihalide of a C2-6 saturated dicarboxylic acid (A2) so that all or some of hydroxyl groups of the phenolic substance (A1) form ester bonds.
Inventors:
Etsuko Suzuki
Kazuo Arita
Kazuo Arita
Application Number:
JP2013526665A
Publication Date:
May 21, 2014
Filing Date:
March 19, 2013
Export Citation:
Assignee:
DIC Corporation
International Classes:
C08G63/692; C08G59/62; C08J5/24; H01L23/29; H01L23/31; H05K1/03; H05K3/46
Domestic Patent References:
| JP2011157434A | 2011-08-18 | |||
| JP2008291279A | 2008-12-04 | |||
| JP2013040270A | 2013-02-28 | |||
| JP2011157434A | 2011-08-18 | |||
| JP2008291279A | 2008-12-04 | |||
| JP2013040270A | 2013-02-28 |
Foreign References:
| WO2010106698A1 | 2010-09-23 | |||
| WO2012002119A1 | 2012-01-05 | |||
| WO2010106698A1 | 2010-09-23 | |||
| WO2012002119A1 | 2012-01-05 |
Other References:
JPN6013048351; 竹内寛、有田和郎: '新規エステルの合成とエポキシ樹脂硬化剤への応用' 第５９回ネットワークポリマー講演討論会・講演要旨集 , 20091015, 第８５頁〜第８８頁
JPN6013048351; 竹内寛、有田和郎: '新規エステルの合成とエポキシ樹脂硬化剤への応用' 第５９回ネットワークポリマー講演討論会・講演要旨集 , 20091015, 第８５頁〜第８８頁
JPN6013048351; 竹内寛、有田和郎: '新規エステルの合成とエポキシ樹脂硬化剤への応用' 第５９回ネットワークポリマー講演討論会・講演要旨集 , 20091015, 第８５頁〜第８８頁
Attorney, Agent or Firm:
Kono Tsuyo