Title:
ACTIVE HARD SOLDER FOR HARD-SOLDERING ALUMINUM OXIDE CERAMIC MEMBER
Document Type and Number:
Japanese Patent JPH10114582
Kind Code:
A
Abstract:
To enable pulverization to a fine particle range in a higher yield than that of a Zr-Ni-Ti alloy by incorporation prescribed amts. of Ti, Be, Fe and Zr.
A mixture consisting of ≤12wt.% Ti, ≤8wt.% Be, <16.5wt.% Fe and the balance Zr optionally with natural impurities is melted and cooled to obtain an active hard solder alloy chip. This alloy chip is reduced to alloy hydride powder having <300μm particle diameter at 100-150°C under about 200kPa (2 bar) absolute pressure in an atmosphere of hydrogen. The resultant powder is converted into powder having such a desired particle diameter as about 12μm with slight pulverizing energy under an ultrahigh pressure of hydrogen in a mill such a ball mill. Hydrogen can be removed in a soldering process.
Inventors:
HEGNER FRANK DR (DE)
SCHMIDT ELKE MARIA DIPL-ING (DE)
GUETHER VOLKER DR (DE)
OTTO ANDREAS (DE)
BREME JUERGEN PROF DR (DE)
MUELLER HEINZ DIPL-ING (DE)
TURNSEK JUERGEN DIPL-ING (DE)
SCHMIDT ELKE MARIA DIPL-ING (DE)
GUETHER VOLKER DR (DE)
OTTO ANDREAS (DE)
BREME JUERGEN PROF DR (DE)
MUELLER HEINZ DIPL-ING (DE)
TURNSEK JUERGEN DIPL-ING (DE)
Application Number:
JP19684097A
Publication Date:
May 06, 1998
Filing Date:
July 23, 1997
Export Citation:
Assignee:
ENDRESS HAUSER GMBH CO (DE)
GFE MET & MAT GMBH (DE)
BREHME JUERGEN (DE)
GFE MET & MAT GMBH (DE)
BREHME JUERGEN (DE)
International Classes:
B23K1/19; B22F9/02; B23K35/32; C04B37/00; C04B37/02; C22C16/00; (IPC1-7): C04B37/02; B23K1/19; B23K35/32; C22C16/00
Attorney, Agent or Firm:
Toshio Yano (2 outside)
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