Title:
ADDITION COPOLYMER, MOLDING MATERIAL, AND RESIN MOLDING
Document Type and Number:
Japanese Patent JP2016196588
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an addition copolymer having a small linear expansion coefficient and excellent low birefringence, a molding material containing the addition copolymer, and a resin molding obtained by molding the molding material.SOLUTION: The addition copolymer is composed of a monomer having a specific ring structure and a 2-10C α-olefin monomer. The contents of repeating units derived from the monomers are within specific ranges. The linear expansion coefficient of the addition copolymer is 40×10to 55×10/°C. The molding material contains the addition copolymer. The resin molding is obtained by molding the molding material.SELECTED DRAWING: None
Inventors:
KOMATSUBARA TAKUYA
TAKARAGAWA TAKUSHI
FUJII KENSAKU
SHIMIZU YASUHIRO
TAKARAGAWA TAKUSHI
FUJII KENSAKU
SHIMIZU YASUHIRO
Application Number:
JP2015077412A
Publication Date:
November 24, 2016
Filing Date:
April 06, 2015
Export Citation:
Assignee:
NIPPON ZEON CO
International Classes:
C08F210/00; C08F232/08
Attorney, Agent or Firm:
Haruhito Oishi