付加製造 - Hewlett-Packard Development Company

Title:

付加製造

Document Type and Number:

Japanese Patent JP6874029

Kind Code:

B2

Abstract:

To form a layer of an unfused construction material, to fuse the construction material of each layer, and to embed a member into the fused build material.SOLUTION: A non-transitory processor-readable medium stored with instructions is provided that, when executed, causes an additive manufacturing device to operate to thereby cause a member 36 to be partially or completely embedded in a layer of a fused construction material 34.SELECTED DRAWING: Figure 7B

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Inventors:

Nauka, Kushitov
Ganapacia bread, Shivapakia
Chao, Rifa
Tom, howard, es
Chao, Yang
Ng, ho, tee

Application Number:

JP2019022332A

Publication Date:

May 19, 2021

Filing Date:

February 12, 2019

Export Citation:

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Assignee:

Hewlett-Packard Development Company
Hewlett-Packard Development Company, L.P.

International Classes:

B29C64/386; B29C64/153; B29C64/165; B29C64/393; B33Y10/00; B33Y30/00; B33Y50/02

Domestic Patent References:

JP2000234104A
JP2000272018A
JP2005007572A
JP2006511365A
JP2005533877A
JP2000190086A

Foreign References:

WO2014152884A1
US20090177309

Attorney, Agent or Firm:

Satoshi Furuya
Akihiro Onishi
Kiyoharu Nishiyama
Rei Hosoi

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