To provide an additive for copper plating in a process for manufacturing a large scale integration circuit, which is not degraded with time after an electrolytic bath has been made up, and adequately embeds copper in a groove and a hole on the circuit even having a finer structure, without producing voids through electrolytic copper plating; a copper plating bath containing the additive; and a copper plating method using the bath.
The additive for copper plating is a compound shown in general formula (1):wherein R1 and R2 are hydrogen, a straight-chain or branched-chain alkyl group of 1 to 6 carbon atoms, or a cycloalkyl group of 5 to 9 carbon atoms, may have a substituent group of 1 to 3 carbon atoms, and may be identical with or different from each other, but all of R1 and R2 are not simultaneously hydrogen; M indicates an alkaline metal, ammonium or monovalent organic ammonium; and n indicates the number of 1 to 7.
SASAKI ASAKO
Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order