Title:
付加型シリコーン樹脂組成物及びこれを使用した光半導体装置
Document Type and Number:
Japanese Patent JP7108432
Kind Code:
B2
Abstract:
To provide an addition type silicone resin composition having heat resistance and little initial coloring, and an optical semiconductor device using the composition.SOLUTION: The addition type silicone resin composition comprises: a linear organovinyl polysiloxane (A1) having at least two silicon-bonded alkenyl groups that react with a SiH group in one molecule; a branched organovinyl polysiloxane (A2) having at least two silicon-bonded alkenyl groups that react with a SiH group in one molecule; an organohydrogen polysiloxane (B) having at least two SiH groups in one molecule; a curing catalyst (C) necessary for an addition reaction; and a heat resistance imparting agent (D). The heat resistance imparting agent (D) comprises a reaction product (M1) of a silazane compound (D1) and a cerium carboxylate (D2). An optical semiconductor is provided, using the above resin composition.SELECTED DRAWING: None
Inventors:
Takushi Mashita
Application Number:
JP2018041430A
Publication Date:
July 28, 2022
Filing Date:
March 08, 2018
Export Citation:
Assignee:
Aica Kogyo Co., Ltd.
International Classes:
C08L83/07; C08K5/5445; C08K5/56; C08L83/05; H01L23/29; H01L23/31
Domestic Patent References:
| JP54032563A | ||||
| JP61185597A | ||||
| JP60240761A |
Foreign References:
| WO2015033979A1 |
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