Title:
継ぎ合わせ結合部用添加材及びその製造方法
Document Type and Number:
Japanese Patent JP2008500186
Kind Code:
A
Abstract:
The invention relates to a filler material for a thermal production of a joint or of a material layer metallically connected to the base material of or on objects of light metal and/or zinc alloys with a thermal conductivity of more than 110 W/mK, and to a method for producing the same with means for the preparation thereof in situ and/or storage. To improve the quality of the connection, it is provided according to the invention that the filler material is formed as unwindable filler wire, built up of a sheath optionally provided with a surface layer formed from polymer(s) and graphite and comprising aluminum and/or magnesium and/or zinc or a deformable alloy of these metals with a thermal conductivity of more than 110 W/mK and a core of compacted powder, whereby the core material comprises a metal powder and/or a powder of at least one metal compound and/or a non-metallic compound and/or an agent giving off gas at increased temperature and/or at least one component forming slag. The production is characterized by a filler wire production known per se, but with an optionally coated sheath of a ductile light metal or the like alloy, with a correctly positioned winding on coils and providing the same with a protection against moisture.
Inventors:
Potsille, Gerhard
Tiegel Hofell, Johann
Baumgartner, Zuzanne
Kruggesz, Wilhelm
Fuerberbauer, Herbert
Tiegel Hofell, Johann
Baumgartner, Zuzanne
Kruggesz, Wilhelm
Fuerberbauer, Herbert
Application Number:
JP2007516868A
Publication Date:
January 10, 2008
Filing Date:
May 25, 2005
Export Citation:
Assignee:
Berrell Syuev Ice Stehnik Austria Gezershyaft Mitt Besilyenktel Haftung
International Classes:
B23K35/02; B23K35/28; B23K35/365; B23K35/368; B23K35/40
Domestic Patent References:
| JP2002205187A | 2002-07-23 | |||
| JP2001259887A | 2001-09-25 | |||
| JPH06304780A | 1994-11-01 | |||
| JP2003311479A | 2003-11-05 | |||
| JP2003305587A | 2003-10-28 | |||
| JPS6466095A | 1989-03-13 |
Foreign References:
| US20030116234A1 | 2003-06-26 |
Attorney, Agent or Firm:
Osamu Nakahira