プライマーを介する基材への被着体の接着

Title:

プライマーを介する基材への被着体の接着

Document Type and Number:

Japanese Patent JP5290750

Kind Code:

B2

Abstract:

A method of bonding an adherent to a substrate, wherein a primer is applied to the substrate by plasma deposition and the adherent is bonded to the primer treated surface of the substrate, and the primer contains functional groups which chemically bond to functional groups in the adherent.

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Inventors:

Reedley, Stuart
Shepherd, nick
O'Neal, Liam
Gabels, Frederick

Application Number:

JP2008511304A

Publication Date:

September 18, 2013

Filing Date:

May 10, 2006

Export Citation:

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Assignee:

Dow Corning Ireland Limited

International Classes:

C09J5/02; B05D1/02; B05D3/04; B05D7/24; B32B7/10; B32B27/00; C09D5/00; C09D183/05; C09D183/07; C09D183/08; C09D201/02; C09J183/07; C09J201/02

Domestic Patent References:

JP8259901A
JP7066549A
JP2004066664A
JP6200217A
JP9052707A
JP60016810A

Attorney, Agent or Firm:

Michiharu Soga
Kajinami order

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