Title:
プライマーを介する基材への被着体の接着
Document Type and Number:
Japanese Patent JP5290750
Kind Code:
B2
Abstract:
A method of bonding an adherent to a substrate, wherein a primer is applied to the substrate by plasma deposition and the adherent is bonded to the primer treated surface of the substrate, and the primer contains functional groups which chemically bond to functional groups in the adherent.
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Inventors:
Reedley, Stuart
Shepherd, nick
O'Neal, Liam
Gabels, Frederick
Shepherd, nick
O'Neal, Liam
Gabels, Frederick
Application Number:
JP2008511304A
Publication Date:
September 18, 2013
Filing Date:
May 10, 2006
Export Citation:
Assignee:
Dow Corning Ireland Limited
International Classes:
C09J5/02; B05D1/02; B05D3/04; B05D7/24; B32B7/10; B32B27/00; C09D5/00; C09D183/05; C09D183/07; C09D183/08; C09D201/02; C09J183/07; C09J201/02
Domestic Patent References:
JP8259901A | ||||
JP7066549A | ||||
JP2004066664A | ||||
JP6200217A | ||||
JP9052707A | ||||
JP60016810A |
Attorney, Agent or Firm:
Michiharu Soga
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