PURPOSE: To closely attach an adhesive tape by closely setting a substrate on which a semiconductor element is formed and the adhesive tape in parallel and supplying the heating gas onto the adhesive tape from the opposite side of the substrate, increasing the opening degree of a throttle and the pressure of the heating gas.

CONSTITUTION: A substrate 11 on which the formation of semiconductor element is completed is held by a vacuum chuck 12, and an adhesive tape 14 held onto a tape supporting frame 15 is arranged, keeping the surface parallel in the vicinity of the substrate. The heating gas 16 is blown onto the adhesive tape 14 on the center axis of the substrate 11 through a throttle 17 from the oppossite side of the substrate 11. The opening degree is gradually increased by controlling the opening degree of the throttle controller 17 by a throttle controller 18, and also the pressure of the heating gas 16 is increased. The adhesive tape 14 starts adhesion for the substrate 11 from the vicinity of the center axis, and the adhesion region is spread, and the tape is applied onto the whole region of the substrate 11. Therefore, perfect adhesion free of gas foam is easily generated between the substrate 11 and the adhesive tape 14.