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Patent Searching and Data


Title:
ADHESION METHOD OF MOLD RELEASING AGENT ON MOLDING DIE FOR MAGNESIUM ALLOY
Document Type and Number:
Japanese Patent JP2002035914
Kind Code:
A
Abstract:

To provide an adhesion method of mold releasing agent onto a molding die for magnesium alloy which prevents undercooling of molding die, reduces a molding cycle time and prevents aggravation of working condition, and also provide a molding die for magnesium alloy.

In a molding die 1 for magnesium alloy consisting of a fixed type 11 and a mobile type 12, while setting the both types face to face within a gap where moldings can be released from mold, the parting agent is sprayed onto material contact surfaces 101, 102 and 109 of both fixed type 11 and mobile type 12. Besides, the supply route 13 of parting agent is installed communicating with material contact surfaces 101, 102 and 109 and the bearing system is also installed to bear both types 11 and 12 within a gap where moldings can be released from mold.


Inventors:
Suzuki, Hideyuki
Application Number:
JP2000000231823
Publication Date:
February 05, 2002
Filing Date:
July 31, 2000
Export Citation:
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Assignee:
DENSO CORP
International Classes:
B22D21/04; B22C3/00; B22C23/02; B22D17/20; B22D21/00; B22C3/00; B22C23/00; B22D17/20; (IPC1-7): B22D17/20; B22C3/00; B22C23/02; B22D21/04