Title:
Adhesion method
Document Type and Number:
Japanese Patent JP5947068
Kind Code:
B2
Inventors:
Kushida Mitsugu
Application Number:
JP2012057885A
Publication Date:
July 06, 2016
Filing Date:
March 14, 2012
Export Citation:
Assignee:
Aica Kogyo Co., Ltd.
International Classes:
C09J131/04; B27D5/00; C09J11/06
Domestic Patent References:
| JP2004035580A | ||||
| JP2001011410A |