Title:
ADHESION STRUCTURE AND ADHESION METHOD
Document Type and Number:
Japanese Patent JP2021195386
Kind Code:
A
Abstract:
To provide an adhesion structure capable of adhering easily and firmly, using a photocurable adhesive agent.SOLUTION: An adhesion structure adheres a substrate 10 and an adhered member 30, using a photocurable adhesive agent 40, the adhesion structure uses an auxiliary member 20, the adhered member and the auxiliary member are installed on the substrate, a first plane 35 of the adhered member and a first plane 25 of the auxiliary member face each other, a gap is formed between both the first planes. The adhesive agent is filled in at least a part of the gap, and a part of the substrate exposed to the gap contacts the adhesive agent filled in the gap.SELECTED DRAWING: Figure 2
Inventors:
TAKAHATA MINORU
Application Number:
JP2020100342A
Publication Date:
December 27, 2021
Filing Date:
June 09, 2020
Export Citation:
Assignee:
FURUUTO KK
International Classes:
C09J201/00; C09J5/00
Attorney, Agent or Firm:
Maeda patent office