To provide an adhesion bonding method suitable for adhesion of a structure to which adhesion bonding by a laser internal heating system is hardly applicable.
An adhesive is used for bonding an adherend made of a first resin material with a second adherend by heating and curing an adhesive by a high-frequency dielectric heating system. The adhesive is configured so that the adhesive is sensitive to high-frequency dielectric heating carried out under application of high frequency waves at a frequency of 28 MHz or 40 MHz, and contains an adhesive component and a high-frequency absorbing filler dispersed in an amount of at least 1 mass% in the adhesive component, the filler having a high dielectric loss factor, capable of generating heat by application of high frequency waves at a frequency of 28 MHz or 40 MHz.
AOKI KOJI
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Takashi Ishida
Tetsuji Koga
Nagasaka Tomoyasu
Yoshihiro Kobayashi