Title:
ADHESIVE AGENT APPLYING METHOD, DEVICE, AND PART MOUNTING METHOD
Document Type and Number:
Japanese Patent JP3121971
Kind Code:
B2
Abstract:
PURPOSE: To quickly, uniformly, and stably feed an adequate amount of adhesive agent to chip parts of various kinds to mount them on an electronic circuit board even if the chip parts are very fine.
CONSTITUTION: Adhesive agent 2 is directly applied onto the flat mounting surface of a chip part 1 from a discharge nozzle 4 of a dispenser 3, the image of the chip part 1 is picked up by a TV camera 6, the chip part 1 is corrected in position at mounting, it is also judged that the adhesive agent applied to the chip part 1 is good in shape or not, and the chip part 1 is mounted at a prescribed position on an electronic circuit board. Or, adhesive agent is applied by the use of a corrective block or a flat belt.
Inventors:
Ryoji Mutou
Hitoshi Soda
Tomoharu Horii
Hideki Ono
Mitsuhiro Harigae
Hitoshi Soda
Tomoharu Horii
Hideki Ono
Mitsuhiro Harigae
Application Number:
JP29300893A
Publication Date:
January 09, 2001
Filing Date:
November 24, 1993
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
B05D1/26; B05C5/00; B05C13/00; B05D7/24; H05K3/34; H05K13/04; H05K13/08; H05K3/30; (IPC1-7): H05K3/34; B05C5/00; B05C13/00; B05D1/26; B05D7/24; H05K13/04; H05K13/08
Domestic Patent References:
| JP336788A | ||||
| JP3217099A |
Attorney, Agent or Firm:
Katsuo Ogawa (2 outside)