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Title:
ADHESIVE AGENT COMPOSITION OF EPOXY RESIN
Document Type and Number:
Japanese Patent JP2008201998
Kind Code:
A
Abstract:

To provide an adhesive agent composition excellent in storage stability and giving a cured product free of voids.

The adhesive agent composition contains (A) an epoxy resin, (B) an epoxy resin curing accelerator, (C) thermoplastic resin particles solid at 25C, (D) a solvent, (E) an epoxy resin curing agent and (F) an inorganic filler. In the composition the components, (A) and (E) are in a state of being dissolved in the component (D) and the components (B), (C) and (F) are in a state of not being dissolved in the component (D).


Inventors:
KANAMARU TATSUYA
HONDA TAKESHI
YAMAGUCHI SHINSUKE
Application Number:
JP2007042570A
Publication Date:
September 04, 2008
Filing Date:
February 22, 2007
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO
International Classes:
C09J163/00; C09J109/00; C09J125/06; C09J133/00; C09J171/10; C09J183/04; H01L21/52
Domestic Patent References:
JP2000319620A2000-11-21
JPH10195279A1998-07-28
JPH0987367A1997-03-31
JP2003165895A2003-06-10
JP2003165826A2003-06-10
JP2004238634A2004-08-26
JP2001220565A2001-08-14
JPH11246743A1999-09-14
Attorney, Agent or Firm:
Mitsuo Matsui



 
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