Title:
ADHESIVE AGENT COMPOSITION FOR SEMICONDUCTOR DEVICE, ADHESIVE AGENT SHEET FOR SEMICONDUCTOR DEVICE USING THE COMPOSITION, SUBSTRATE FOR SEMICONDUCTOR CONNECTION, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3956771
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To industrially provide a new adhesive agent composition for a semi conductor device wherein superior adhesion and thermal resistance can be simul taneously achieved while superior transparency and a discriminating property are held, an adhesive agent sheet for a semiconductor device which uses the composition and a semiconductor device, and to improve the reliability and productivity of a semiconductor device.
SOLUTION: The adhesive agent composition for a semiconductor device characterized by that the transmittance of a parallel ray is at least 5% and a haze value is 10-80%, the adhesive agent sheet for a semiconductor device which uses the composition, a substrate for semiconductor connection and the semiconductor device are obtained.
Inventors:
Yoko Osawa
Junko Iwasaki
Shoji Kikoshi
Junko Iwasaki
Shoji Kikoshi
Application Number:
JP2002146210A
Publication Date:
August 08, 2007
Filing Date:
May 21, 2002
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
C09J7/00; H01L23/12; C09J201/00; H01L21/60; (IPC1-7): H01L23/12; C09J7/00; C09J201/00; H01L21/60
Domestic Patent References:
| JP2001294843A | ||||
| JP6132355A | ||||
| JP6347419A | ||||
| JP1113477A | ||||
| JP11131042A |
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