Title:
ADHESIVE APPLICATION DEVICE, SHEET PROCESSING DEVICE INCLUDING ADHESIVE APPLICATION DEVICE, AND IMAGE FORMATION DEVICE INCLUDING SHEET PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2015120565
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive application device which easily applies an adhesive to sheets to form sheet bundles without using metal staples and a sheet deformation binding mechanism and inhibits deviation of the adhesive from an application position and misalignment of the sheets bonded to each other during adhesion.SOLUTION: An adhesive application device 50 applies an adhesive to sheets transferred on a platen 79 and includes: a device frame 50c; adhesion means 51 which are arranged in a sheet width direction; support means which supports the adhesion means 51 on the device frame 50c so that the adhesion means 51 may move between an adhesion position where the adhesion means 51 apply the adhesive to the sheet and press the sheet and a separation position where the adhesion means 51 are separated from the sheet; and sheet restriction means 65 which is provided along with the adhesion means 51 in the sheet width direction and restricts the sheet on the platen 79 in conjunction with movement of the adhesion means to the adhesion position.
Inventors:
OSADA HISASHI
TAKEI AKIRA
FUKAZAWA EIJI
TAKEI AKIRA
FUKAZAWA EIJI
Application Number:
JP2013263884A
Publication Date:
July 02, 2015
Filing Date:
December 20, 2013
Export Citation:
Assignee:
NISCA CORP
International Classes:
B65H37/02; G03G15/00
Domestic Patent References:
| JP2008214081A | 2008-09-18 | |||
| JP2009202485A | 2009-09-10 | |||
| JP2009269746A | 2009-11-19 |