To prevent a recording element substrate from being contaminated due to the scattering of an adhesive, when an electric wiring board is bonded to a recording element unit mounted with a recording element substrate.

A shielding wall 3j which descends so as to surround recording element substrates 103 and 104, is provided inside a transfer member 3f for transferring an adhesive A to the surface of a second plate 102 of the recording element unit 100. In addition, the shielding wall 3j descends ahead of the transfer member 3f during transferring the adhesive A. Further, after the transfer of the adhesive A, the recording element substrates 103 and 104 can be protected against a contamination to be caused by a cobwebbing phenomenon of the adhesive A with an increased viscosity, when the shielding wall 3j ascends later than the transfer member 3f.