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Title:
ADHESIVE APPLYING DEVICE AND ADHESIVE APPLYING METHOD
Document Type and Number:
Japanese Patent JP2009268949
Kind Code:
A
Abstract:

To provide an adhesive applying device and an adhesive applying method by which the stringing phenomenon is suppressed and the application state of an adhesive is stabilized.

The adhesive application device includes: an adhesive supply means 30 for supplying the adhesive H; an adhesive application roller 4 having a rotating outer peripheral surface 5 on which the adhesive H is supplied from the adhesive supply means 30 and from which the adhesive H is transferred on a work W; and a cooling means provided on the adhesive application roller 4 to cool the outer peripheral surface 6 of the adhesive application roller 4.


Inventors:
TATSUKI TOMONORI
SEGAWA TERUO
Application Number:
JP2008119772A
Publication Date:
November 19, 2009
Filing Date:
May 01, 2008
Export Citation:
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Assignee:
NISSAN MOTOR
International Classes:
B05C5/04; B05C1/02; C09J5/00
Attorney, Agent or Firm:
Hatta International Patent Corporation