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Title:
ADHESIVE AUTOMATIC APPLYING DEVICE AND ADHESIVE AUTOMATIC APPLYING METHOD
Document Type and Number:
Japanese Patent JP2000126665
Kind Code:
A
Abstract:

To prevent use of excessive adhesive, unevenness of coating, deficiency in adhesive force due to shortage of adhesive by controlling the applied quantity and applying time of the adhesive by an applying means according to the presence and absence of a panel frame body and the conveying speed of the panel frame body.

Work is detected by work detecting sensors 26, 27. Floor joists are detected by frame material detecting sensors 28-31. Solenoid valves 47-50 for discharge valves 32-35 installed making a pair with the frame material detecting sensors 28-31 respective are turned on by a program controller 51. The discharge valves 32-35 that have turned on the solenoid valves 47-50 open discharge ports thereof with the opening degree corresponding to the adjusted air output to discharge adhesive of a prescribed flow rate to output pressure of air of an electropneumatic pressure regulating valve. In this way, the prescribed flow rate of the adhesive is discharged to apply the adhesive of the flow rate suitable for conveying speed to floor joints.


Inventors:
NARUSE TOSHIO
Application Number:
JP30224798A
Publication Date:
May 09, 2000
Filing Date:
October 23, 1998
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
CHUBU SEKISUI KOGYO KK
International Classes:
B05D7/24; B05C5/02; (IPC1-7): B05C5/02; B05D7/24
Attorney, Agent or Firm:
99 high autumn