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Patent Searching and Data


Title:
ADHESIVE BASE PLATE FOR WIRING FIXING MEANS, AND WIRING FIXING MEANS
Document Type and Number:
Japanese Patent JP2005295779
Kind Code:
A
Abstract:

To provide an adhesive base plate for a wiring fixing means that hardly peels off from an attached portion and the product yield of which is high and the wiring fixing means using this adhesive base plate.

This adhesive base plate for the wiring fixing means has an adhesive layer on one side of the base plate and a sheet of release paper covering it and is provided with the wiring fixing means on the other side. It is shaped hexagonally by blanking process. The wiring fixing means is constituted of a ribbon containing a core wire like a wire that is bent into roughly a U shape and passed from the release paper side through two holes provided on the adhesive base plate, which has an adhesive layer on one side of the base plate and a sheet of release paper covering it in such a way as to penetrate the base plate and the release paper through the adhesive layer. The base plate is shaped hexagonally.


Inventors:
NANDATSU YOSHITETSU
Application Number:
JP2004132242A
Publication Date:
October 20, 2005
Filing Date:
March 31, 2004
Export Citation:
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Assignee:
TOKYO CHEMICAL KK
International Classes:
F16B5/12; F16B2/08; F16B47/00; H02G3/30; (IPC1-7): H02G3/30; F16B2/08; F16B5/12; F16B47/00